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Keywords: Optoelectronics

Market Overview

This technology increases the energy efficiency of optoelectronic applications by increasing the optical confinement and energy density in the longitudinal and transverse planes. This increases the efficacy of devices such as LIDAR, free-space communications, and optical manipulations. The global market for optoelectronics is growing at a CAGR of 18.3% from 2016 to 2023. The growth in this market is driven from the high demand for bandwidth and current power constraints. This invention would increase power output and bandwidth all while lowering the necessary power needed.
Judson Ryckman
2019-022

Applications:

All-dielectric silicon nanophotonic for increased optical confinement and lower power usage

Technical Summary:

This technology has two features that enhance the energy densities of optical wavelengths in both the longitudinal and transverse dimensions. The inventor introduced a new pathway for enhancing optical confinement in the transverse plane of a waveguide using orthogonal boundary conditions of Maxwell’s equations, and optionally in the longitudinal dimension of a waveguide using “periodic spatial refocusing” (PSR). This unique approach can achieve extreme light confinement and ultra-high energy densities and offers record low mode areas to be realized in a theoretically lossless all-dielectric platform for the first time. Applying these principles to specific types of active opto-electronic devices is predicted to enable up to ~10-1000x energy efficiency scaling.

Advantages:

• All-dielectric design, allowing for significantly lower losses compared to plasmonic approaches
• Ultra-low waveguide mode areas, yielding increased optical energy densities which favor improved device performance with lower power requirements
• First-time realization of optical devices achieving the optical confinement and enhanced light-matter interactions

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Technology Overview

State of Development

Proof of concept prototype

Patent Type

Provisional

Category

Advanced Materials

Serial Number

62/844,815

CURF Reference No.

2019-022

Inventors

Judson Ryckman


For More Info, Contact:

Andy Bluvas

Technology Commercialization Officer bluvasa@clemson.edu

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